Semiconductor Packaging: Materials Interaction and Reliability (Record no. 17897)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00430nam a22001577a 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20260307215516.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 260307b |||||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781138075405 |
| 040 ## - CATALOGING SOURCE | |
| Transcribing agency | nmit |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Chen, Andrea |
| 245 ## - TITLE STATEMENT | |
| Title | Semiconductor Packaging: Materials Interaction and Reliability |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Place of publication, distribution, etc. | New York |
| Name of publisher, distributor, etc. | CRC Press |
| Date of publication, distribution, etc. | 2012 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | xviii, 198 |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Yu Lo, Randy Hsiao |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Dewey Decimal Classification |
| Koha item type | Books |
| Suppress in OPAC | No |
No items available.