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Electrical Conductive Adhesives with Nanotechnologies [electronic resource] / by Yi Li, Daniel Lu, C. P. Wong. by
Material type: Text Text; Format: electronic available online remote; Literary form: Not fiction
Publisher: Boston, MA : Springer US, 2010 In: Springer eBooks
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Availability: No items available.

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Advanced Flip Chip Packaging [electronic resource] / edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong. by
Material type: Text Text; Format: electronic available online remote; Literary form: Not fiction
Publisher: Boston, MA : Springer US : Imprint: Springer, 2013 In: Springer eBooks
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Availability: No items available.

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