| 000 | 00430nam a22001577a 4500 | ||
|---|---|---|---|
| 005 | 20260307215516.0 | ||
| 008 | 260307b |||||||| |||| 00| 0 eng d | ||
| 020 | _a9781138075405 | ||
| 040 | _cnmit | ||
| 100 | _a Chen, Andrea | ||
| 245 | _aSemiconductor Packaging: Materials Interaction and Reliability | ||
| 260 |
_aNew York _bCRC Press _c2012 |
||
| 300 | _axviii, 198 | ||
| 700 | _aYu Lo, Randy Hsiao | ||
| 942 |
_2ddc _cBK _n0 |
||
| 999 |
_c17897 _d17897 |
||