| 000 | 00429nam a22001577a 4500 | ||
|---|---|---|---|
| 005 | 20260308103817.0 | ||
| 008 | 260308b |||||||| |||| 00| 0 eng d | ||
| 020 | _a9781138075405 | ||
| 040 | _cnmit | ||
| 100 | _a Chen, Andrea | ||
| 245 | _aSemiconductor Packaging: Materials Interaction and Reliability | ||
| 260 |
_aNew York _bCRC Press _c2012 |
||
| 300 | _axviii, 198 | ||
| 700 | _aYu Lo, Randy Hsiao | ||
| 942 |
_2ddc _cBK _n0 |
||
| 999 |
_c17898 _d17898 |
||